LogoIC Process Flow■Customer客户IC DesignSMTIC设计IC组装Wafer FabWafer ProbeAssembly&Test晶圆制造晶圆测试IC封装测试www.1ppt.comCompany Logo

本章内容沾污的类型，来源，后果，去除方法■硅片清洗，方案，流程，评估要点。·先进的干法清洗方案介绍

2本节课主要内容硅片清洗湿法清洗：Piranha,RCA (SC-1,SC-2),HF:H2O物理清洗王法清洗：气相化学吸杂三步骤：激活，护散，俘获碱金属：PSG,超净化十SiN钝化保护其他金属：本征吸杂和非本征吸杂大...

第3章清洗工艺(机械工业出版社CHINA MACHINE PRESSwww.cmpedu.com

OutlineCMP OverviewAMAT Tool,Mirra-MesaCMP ConsumableSlurryPolish PadDiamond DiskCMP ProcessSTI,ILD and IMD CMPPoly CMP>Tungsten CMPCopper CMP

Outline:Poly process introductionProcess gas introductionPoly etcher introductionRIE introductionPoly chamber introductionP.2

Contents:1.Introduction of metal etch2.Metal etch defect --Corrosion3.Metal etcher tool introduction4.Common metal etch process trendsP.2

Outline1.IC Typical Schematic2.PVD Technology3.AlCu PVD4.Salicide PVD5.Barrier PVD6.WCVD

Process Flow1.Wafer start P-typeP-sub2

第10章平坦化(机械工业出版社CHINA MACHINE PRESSwww.cmpedu.com