Process Flow1.Wafer start P-typeP-sub2

Content▣Vhat is CVDDCVD Application in IC Process▣CVD ProcessLow K materials

第10章平坦化(机械工业出版社CHINA MACHINE PRESSwww.cmpedu.com

WAT Introduction1.WAT是什么2.WAT系统介绍3.WAT测试项日及方法

IC Process FlowCustomer客户IC DesignSMTIC设计IC组装Wafer FabWafer ProbeAssembly&Test晶圆制造品圆测试IC封装测试

目录*1.硅料的提炼米2.单晶硅片工艺流程米3.单晶炉展示4.产品展示5.单晶炉种类*6.单晶炉结构*7.各个部件的作用*8.单晶工艺流程*9.晶升，埚升介绍10.加热部分

imart360震坤行Introduction of IC Assembly ProcessIC封装工艺简介Al right reserved Shanghai Imart 360

FOL-Back Grinding背面减薄BackTaping粘胶带GrindingDe-Taping磨片去胶带晶圆625-700A7-12mil胶带>将从晶圆厂出来的Vafer:进行背面研磨，来减薄晶圆达到封装需要的厚度(8mils~10mils)>磨片时，...

Purpose of Wet Cleaning ProcessThrough to a series of processes to make thewafers free from particles,organiccontaminations,metal contamination,surfacemicroroughness and native oxi...

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